Disassemble the instrument does not apply to software maintenance and version into one chip models ( such as Motorola L2000, 2588 , Siemens , Motorola T2688 , etc. ) .

    Whether using free software maintenance or use disassemble disassemble software maintenance , data must be written prior to view the phone version , even the same type of phone ,

    Due to their different production date and origin , and its version number may be different , so the cell phone repair process, the software must check its version handling , otherwise it will not boot or some cause functional failure and other failures.

    In addition , many of the phone's font with a BGA package , if not very sure , especially beginners do not go move on him, because BGA package IC for demanding welding technology , when to use specialized heavy equipment welding tools (BGA soldering tool set ) , otherwise it will more repair complex.